Senior Packaging Engineer Power & HPC Semis
Listed on 2026-10-16
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Engineering
Packaging Engineer, Systems Engineer
NXP Semiconductors in Chandler, AZ seeks a Semiconductor Packaging Engineer to serve as a technical lead, defining and delivering package solutions for new products and technologies across NXP business lines. Responsibilities include creating architectures, materials, structures, and process flows to meet reliability, performance, manufacturability, and cost goals.
You will drive cross-functional programs, monitor packaging trends, define technology roadmaps, and ensure deliverables for NPIs and
The following opportunity is for a Senior Packaging Engineer for Power & HPC Semis with NXP Semiconductors.
Join NXP Semiconductors and contribute to our ongoing work.
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This posting is for the Senior Packaging Engineer for Power & HPC Semis role at NXP Semiconductors, based in Chandler, AZ, United States.
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