Laser Packaging Process Engineer Advanced Semiconductors
Listed on 2026-10-16
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Engineering
Process Engineer, Packaging Engineer, Manufacturing Engineer, Quality Engineering
Intel is seeking a Packaging Module Development Engineer in Laser Assembly based in Phoenix, AZ. You will shape next-generation laser packaging processes and equipment to enhance performance, reliability, and yield across Intel's assembly and packaging solutions.
The role requires strong skills in SPC/DOE, laser and optical systems, and collaboration with cross-functional teams. This college-grad position emphasizes hands-on development and rapid contribution in a fast-paced environment.
This is a genuine opening to take on the Laser Packaging Process Engineer for Advanced Semiconductors role at Intel Corporation.
Learn more about the Laser Packaging Process Engineer for Advanced Semiconductors role in the description above.
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