Lead, Substrate Supplier Enablement Advanced Packaging
Listed on 2026-10-17
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Engineering
Packaging Engineer, Quality Engineering
Intel Corporation in the United States (Arizona, Phoenix) seeks an experienced engineer to lead substrate technology development and supplier readiness for advanced packaging programs such as high density FCBGA, EMIB-T, and glass core substrate.
You will drive process integration roadmaps, perform data-driven yield analysis, and manage supplier performance with cross-functional teams across Intel. Occasional travel to supplier sites and East Asia will be required.
This is an excellent role to take on the Lead, Substrate Supplier Enablement for Advanced Packaging role at Intel Corporation.
The Lead, Substrate Supplier Enablement for Advanced Packaging position in the IT & Technology, Engineering field is open for applications.
We have an opening for a Lead, Substrate Supplier Enablement for Advanced Packaging in Chandler, AZ, United States within IT & Technology, Engineering.
This role, Lead, Substrate Supplier Enablement for Advanced Packaging at Intel Corporation, could be your next opportunity.
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