Principal Packaging Engineer — Advanced Packaging Leader
Listed on 2026-10-17
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Engineering
Packaging Engineer, Materials Engineering
NXP Semiconductors seeks a seasoned Semiconductor Packaging Engineer to act as technical lead in Package Innovation, defining architectures, materials, and processes to meet reliability, performance, manufacturability, and cost targets. The role supports vehicle electrification, power management, robotics, and high-performance compute across business lines.
You will drive cross-functional programs with Marketing, Design, Product Engineering, Silicon Design, and OSATs; monitor advances in PLP and
The following role is for a Principal Packaging Engineer — Advanced Packaging Leader with NXP Semiconductors NV.
Consider building your career as a Principal Packaging Engineer — Advanced Packaging Leader at NXP Semiconductors NV.
The Principal Packaging Engineer — Advanced Packaging Leader position in the IT & Technology, Engineering field is open for applications.
We have an opening for a Principal Packaging Engineer — Advanced Packaging Leader in Chandler, AZ, United States within IT & Technology, Engineering.
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