IC Packaging Design Engineer
Job in
Chandler, Maricopa County, Arizona, 85249, USA
Listed on 2026-10-17
Listing for:
Anysilicon
Full Time
position Listed on 2026-10-17
Job specializations:
-
Engineering
Electronics Engineer, Systems Engineer, Electrical Engineering
Job Description & How to Apply Below
Scalable Systems, Chandler, AZ 85248 Hybrid work
Job Description:
We are seeking a highly skilled IC Package Design Engineer to contribute to a new product development project. This role requires expertise in IC packaging design and a strong background in electrical or electronics engineering.
Responsibilities:
- Design and implement IC packaging solutions for new products.
- Ensure design compliance with industry standards and specifications.
- Collaborate with cross-functional teams to optimize design for performance and manufacturability.
- Conduct substrate design and layout, focusing on SI/PI aware design implementation.
- Evaluate and enhance design for yield and reliability.
Qualifications:
- Bachelor’s or Master’s degree in Electrical/Electronics Engineering.
Skills:
- Strong hands‑on experience with Siemens (Mentor) Xpedition (XPD) or Cadence Allegro/Advanced Package Designer (APD/SIP).
- Expertise in physical design and layout.
- Knowledge of design rule compliance and best practices in IC packaging.
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