Hybrid IC Packaging Design Engineer
Listed on 2026-10-18
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Engineering
Packaging Engineer, Systems Engineer, Manufacturing Engineer
Scalable Systems in Chandler, AZ is seeking an IC Package Design Engineer to contribute to a new product development project, bringing expertise in packaging design and a strong background in electrical engineering.
You will design packaging solutions, ensure compliance with industry standards, and collaborate with cross-functional teams to optimize performance, manufacturability, yield and reliability.
The Hybrid IC Packaging Design Engineer role at Anysilicon is now open for applications in Chandler, AZ, United States.
If your experience matches this role, we encourage you to apply.
All applications are reviewed carefully by our team.
The position is based in Chandler, AZ, United States.
This opportunity is part of our work in Engineering.
The advertised compensation is 90..
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
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