IC Packaging Design Engineer

Job Title : IC Packaging Design Engineer

Job Location : Chandler, AZ/ Hillsboro, OR (Onsite)

Duration : 12+ Months

Job Description:

As an IC Packaging Design Engineer, you'll work on physical design and layout of IC packages, driving substrate design and SI/PI-aware implementation for high-performance semiconductor products. You'll collaborate closely with cross-functional teams to ensure designs meet performance, manufacturability, yield, and reliability targets.

What You'll Do

• Perform physical design and layout of IC packages
• Execute substrate design and layout
• Implement SI/PI-aware design practices
• Design for performance, manufacturability, yield, and reliability (DFM/DFY/DFR)
• Ensure design rule compliance across all deliverables
• Use Siemens (Mentor) Xpedition (XPD) or Cadence Allegro/Advanced Package Designer (APD/SiP) for design execution

What You Bring

• Bachelor's or Master's degree in Electrical/Electronics Engineering
• Senior-level: ~10+ years in IC packaging / package design, OR
• Mid-level: 4–6+ years (MS) or 6+ years (BS) in IC packaging / package design
• Strong hands-on experience in Siemens Xpedition (XPD) or Cadence Allegro/APD (SiP)
• Proven experience in substrate design, SI/PI-aware implementation, and design rule compliance