Packaging Module Development Engineer – Semiconductors
Listed on 2026-10-20
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Engineering
Packaging Engineer, Process Engineer, Manufacturing Engineer, Electrical Engineering
Intel Corporation in Arizona is seeking a Packaging Module Development Engineer to join our Epoxy MEOS team. You will develop and optimize assembly and packaging processes for next-generation semiconductor products.
This is an exciting early-career role to apply academic knowledge in a world-class manufacturing environment, contribute to meaningful projects, and grow alongside some of the brightest minds in the semiconductor industry.
We invite applications for the Packaging Module Development Engineer – Semiconductors position located in Chandler, AZ, United States.
For the Packaging Module Development Engineer – Semiconductors position at Intel Corporation, we are reviewing applications now.
Step into the Packaging Module Development Engineer – Semiconductors role at Intel Corporation in Chandler, AZ, United States and grow with us.
Please review the full job details above before applying.
If your experience matches this role, we encourage you to apply.
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