Night Shift Module Engineer – Semiconductor Packaging
Listed on 2026-10-20
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Engineering
Packaging Engineer, Manufacturing Engineer, Process Engineer
Intel Corporation in Chandler, Arizona, is seeking a Module Engineer On Shift (MEOS) for its Substrate Packaging Technology Development (SPTD) team. You will support a 24x7 manufacturing line on the factory floor, addressing equipment and process issues and ensuring smooth lot movement.
The role requires strong problem-solving and communication skills, adaptability, and initiative. The position is on-site in Arizona with competitive compensation and benefits.
We are seeking a motivated Night Shift Module Engineer – Semiconductor Packaging to join Intel Corporation in Chandler, AZ, United States.
Join Intel Corporation and contribute to our ongoing work.
Take a moment to read everything above and see whether this role is right for you.
This posting is for the Night Shift Module Engineer – Semiconductor Packaging role at Intel Corporation, based in Chandler, AZ, United States.
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