Head of Advanced Packaging Research & Integration
Listed on 2026-10-17
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Manufacturing / Production
Packaging Engineer
Intel Corporation is seeking a Semiconductor Packaging Integration Research Manager in the United States (Arizona, Phoenix area) to lead advanced packaging integration research for next‑generation heterogeneous semiconductor technology.
The role drives early‑stage integration strategies, architecture trade‑offs, and feasibility demonstrations while collaborating with device, process, materials, reliability, modeling, test, and manufacturing teams.
We have an opening for a Head of Advanced Packaging Research & Integration in Chandler, AZ, United States within Management & Operations, Engineering.
Join us at Intel Corporation as our next Head of Advanced Packaging Research & Integration in Chandler, AZ, United States.
We are currently recruiting a Head of Advanced Packaging Research & Integration for our team in Chandler, AZ, United States.
This is a great opportunity to take on the Head of Advanced Packaging Research & Integration role at Intel Corporation.
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