Microelectronic Bonder: High-Precision Wire Bonding
Listed on 2026-11-06
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Quality Assurance - QA/QC
Electronics Engineer, Production QC/QA
Lockheed Martin Missiles & Fire Control in Chelmsford, MA is seeking a Microelectronic Bonder to perform high-precision wire-bonding and hybrid circuit fabrication for critical defense systems.
You will work with small pad sizes, diverse substrates, and strict quality standards in a team environment, with opportunities for professional growth and comprehensive benefits. Candidates must be U.S. citizens and able to obtain a Secret clearance.
This is an excellent opening to take on the Microelectronic Bonder:
High-Precision Wire Bonding role at Lockheed Martin.
For the Microelectronic Bonder:
High-Precision Wire Bonding position at Lockheed Martin, we are reviewing applications now.
Step into the Microelectronic Bonder:
High-Precision Wire Bonding role at Lockheed Martin in Chelmsford, MA, United States and grow with us.
Please review the full job details above before applying.
If your experience matches this role, we encourage you to apply.
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