Bim Specialist
Listed on 2025-12-31
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Engineering
Engineering Design & Technologists
About Us
When you work at Chugach Government Solutions (CGS), you join a proud legacy of supporting missions while sustaining culture.
The federal division of Chugach Alaska Corporation, CGS has been supporting critical missions as a government contractor for over 25 years. Our focus is to support facility maintenance, IT/technical services, construction and education. We are proud to have built, and continue to foster, an incredibly talented team spanning across the globe in hundreds of different fields - each team member proud to serve our country with first‑class business services, while also making a difference for our Chugach shareholders.
At CGS, empowering employees is a part of our core, and that focus is one of the ways we build and foster high‑performing teams. We empower our employees through competitive compensation and benefits package, professional growth opportunities, truthful communication, and more!
If you are looking for an opportunity to serve something bigger than yourself; if you want your day job to be one that creates meaningful value; if you are looking for an environment that highly values employees and respects individual differences - then Chugach Government Solutions may be the right fit for you!
Job OverviewProvide 3D Building Information Modeling (BIM), 3D imagery (photogrammetry and Light Detection and Ranging (LiDAR) scans), and aerial high‑resolution Ortho mosaic imagery using Autodesk Revit for all customer sites, towers, structures, and equipment. All models must be georeferenced, compatible with Esri ArcGIS environments, and all technology used must meet U.S. government security requirements under Section 889 of the National Defense Authorization Act (NDAA).
Work Model:
Onsite
Essential Duties &
Job Functions:
- Capture 3D models of internal and external sites, towers, structures, and equipment using photogrammetry and LiDAR technology.
- Capture high‑resolution two‑dimensional (2D) ortho mosaic aerial imagery using unmanned aerial vehicles (UAVs) or similar equipment, ensuring a Ground Sample Distance (GSD) of 2‑5 cm per pixel to meet high spatial accuracy and inspection‑level detail.
- Ensure models are georeferenced to meet integration standards for ArcGIS. Accuracy for 3D imagery must achieve the same GSD of 2‑5 cm per pixel for photogrammetry and LiDAR, ensuring fine‑detail resolution.
- Provide BIM models that adhere to level of development (LOD) 300 for electronic systems and LOD 200 for infrastructure, ensuring accuracy in both.
- Capture Networks and Power Distribution:
Model both local and external network connections, showing system interconnections and accurately mapping power distribution. - Develop Interactive Mapping:
Provide system‑level mapping of power, network paths, and communication links, enabling isolation and highlighting of individual components. - Maintain Industry Foundation Classes (IFC) Standards:
All BIM models must comply with IFC standards to ensure consistent spatial accuracy and asset representation. - Collect Basic System Identification:
Capture visual representations of equipment as interactive 3D objects with metadata (e.g., make, model, serial number, etc.). - Provide 360‑Degree Panoramic and Still Photography:
Include strategically captured 360‑degree panoramic photos and still images of key equipment, integrated with the 3D imagery to enhance spatial context. - Collect warranty information, maintenance history, installation dates, software/firmware versions, and next service dates. Ensure metadata fields are properly formatted with placeholders for government updates.
- Collect and deliver metadata aligned with both IFC and Construction Operations Building Information Exchange (COBie) standards. The metadata structure, including families, elements, parameters, and Unique Identifiers (UIDs), must be agreed upon by the government at the project's outset.
- Provide 3D BIM Models:
Comprehensive Autodesk Revit models incorporating all electronic systems and infrastructure, meeting LOD 300 for electronic systems and LOD 200 for infrastructure. - Collect 3D Imagery Data:
Processed LiDAR and photogrammetry datasets, ready for integration into BIM…
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