Packaging Engineer: Onsite HPC Packaging & Testing
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Engineering
Job Description & How to Apply Below
Hewlett Packard Enterprise is seeking a Packaging Engineer in Chippewa Falls, WI. The role focuses on designing and validating crating, corrugated, and foam packaging for HPC products, onsite at an HPE office.
You typically hold a Bachelor's or Master's in Mechanical Engineering with 2–5 years of experience and are proficient in Solid Works or CREO. Strong communication and problem-solving skills are essential.
We invite applications for the Packaging Engineer:
Onsite HPC Packaging & Testing position located in Chippewa Falls, WI, United States.
We appreciate your interest in this position.
Join Hewlett Packard Enterprise and contribute to our ongoing work.
Take a moment to read everything above and see whether this role is right for you.
This posting is for the Packaging Engineer:
Onsite HPC Packaging & Testing role at Hewlett Packard Enterprise, based in Chippewa Falls, WI, United States.
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