VP of Engineering — Hardware-First, RF/Embedded
Listed on 2026-10-12
-
Engineering
Hardware Engineer
Radenso Labs in Cincinnati, OH is seeking a Vice President of Engineering to translate product direction into actionable hardware and software plans. This is a hardware-first leadership role guiding ~10 engineers across electrical, RF, FPGA, embedded software, and AI/ML.
You will own the full hardware lifecycle from concept through production, balance cost and performance, and ensure predictable execution. On-site collaboration with CEO and program leads is essential.
The following opening is for a VP of Engineering — Hardware-First, RF/Embedded with Radenso Labs.
Learn more about the VP of Engineering — Hardware-First, RF/Embedded role in the description above.
We appreciate your interest in this position.
Join Radenso Labs and contribute to our ongoing work.
Take a moment to read everything above and see whether this role is right for you.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).