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PCB Layout Designer

Job in Cincinnati, Hamilton County, Ohio, 45208, USA
Listing for: Chipton-Ross, Inc.
Full Time position
Listed on 2026-10-22
Job specializations:
  • Engineering
    Electronics Engineer, Electrical Engineering, Manufacturing Engineer
Salary/Wage Range or Industry Benchmark: 64 - 105 USD Hourly USD 64.00 105.00 HOUR
Job Description & How to Apply Below

Rate Up to $105.87 DOE

Duration 6 months

Openings 2

Education Bachelor's Degree

Experience 8+ years

Clearance Top Secret

Posted Oct 19, 2026

Job Description

Job #220235

BASIC QUALIFICATIONS (REQUIRED SKILLS/EXPERIENCE)
  • 8 Years with Bachelors in Science; 6 Years with Masters; 4 Years with PhD.
  • Willingness and ability to work on?site full?time at the Cincinnati, OH location.
  • Minimum 8 years of experience performing engineering/layout of printed circuit boards using Xpedition.
  • Experience with the layout of multi?layer, high?density PCBs and circuit card assemblies, including placement and routing of high?speed digital, RF, and/or mixed?signal circuits.
  • Experience collaborating with diverse stakeholders across organizations and programs, including electrical design, mechanical design, manufacturing, test, and/or signal integrity.
  • Working knowledge of PCB fabrication and assembly processes, including common manufacturability and yield considerations.
  • Familiarity with IPC industry standards for PCB design and fabrication and current understanding of high?reliability criteria.
  • Experience generating artwork and PCB/CCA documentation for procurement and assembly houses.
  • Excellent organizational and problem?solving skills with a demonstrated ability to adapt effectively to changing requirements.

Basic Qualifications for a Staff PCB Layout Designer:

  • 12 Years with Bachelors in Science; 10 Years with Masters; 8 Years with PhD.
  • Willingness and ability to work on?site full?time at the Cincinnati, OH location.
  • Minimum 12 years of experience performing engineering/layout of printed circuit boards using Xpedition.
  • Experience with the layout of multi?layer, high?density PCBs and circuit card assemblies, including placement and routing of high?speed digital, RF, and/or mixed?signal circuits.
  • Experience collaborating with diverse stakeholders across organizations and programs, including electrical design, mechanical design, manufacturing, test, and/or signal integrity.
  • Working knowledge of PCB fabrication and assembly processes, including common manufacturability and yield considerations.
  • Familiarity with IPC industry standards for PCB design and fabrication and current understanding of high?reliability criteria.
  • Experience generating artwork and PCB/CCA documentation for procurement and assembly houses.
  • Excellent organizational and problem?solving skills with a demonstrated ability to adapt effectively to changing requirements.
POSITION RESPONSIBILITES
  • Execute the placement and routing of complex, high?density, multi?layer printed circuit boards (PCBs), including high?speed digital, RF, mixed?signal, and power circuits.
  • Interpret electrical schematics, constraints, and mechanical boundaries to develop optimized PCB layouts that meet performance, reliability, and manufacturability requirements.
  • Generate and maintain complete PCB and circuit card assembly (CCA) fabrication and assembly documentation packages, including artwork, drawings, fabrication notes, and data outputs for procurement and assembly partners.
  • Apply current IPC and high?reliability industry standards, as well as applicable military and aerospace criteria, in the design and verification of printed wiring boards and circuit card assemblies.
  • Collaborate closely with electrical, mechanical, manufacturing, and signal integrity engineers to address layout?related design challenges involving signal integrity, power integrity, thermal management, and packaging.
  • Support and perform Design for Manufacturing (DFM), Design for Assembly (DFA), and Design for Test (DFT) reviews using automated and manual checks to improve yield, test coverage, and product robustness.
  • Work with fabrication and assembly suppliers to understand manufacturing capabilities and constraints and incorporate…
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