Engineer Circuit Design

Engineer Circuit Design 3

Job#: 3056332

Job Description:

Engineer Circuit Design 3

Location:

Cincinnati, Ohio (On-site)

Role Overview A professional opportunity is available for a qualified circuit designer to join our organization in Cincinnati, Ohio. This position involves supporting the design and delivery of high-reliability circuit card assemblies. The successful candidate will collaborate across electrical, mechanical, manufacturing, and signal integrity disciplines to transform complex electrical architectures and schematics into robust, production-ready printed circuit board solutions. This role requires a collaborative, team-oriented professional with a commitment to technical excellence and continuous learning.

Key Responsibilities Execute the placement and routing of complex, high-density, multi-layer printed circuit boards, including high-speed digital, RF, mixed-signal, and power circuits.

Interpret electrical schematics, constraints, and mechanical boundaries to develop optimized layouts that meet performance, reliability, and manufacturability requirements.

Generate and maintain complete fabrication and assembly documentation packages, including artwork, drawings, fabrication notes, and data outputs for partners.

Apply current industry standards and criteria in the design and verification of printed wiring boards and circuit card assemblies.

Collaborate with engineering teams to address layout-related design challenges involving signal integrity, power integrity, thermal management, and packaging.

Support and perform Design for Manufacturing, Design for Assembly, and Design for Test reviews using automated and manual checks to improve yield.

Work with fabrication and assembly suppliers to incorporate manufacturing capabilities and constraints into physical designs.

Support library management practices, ensuring correct use of symbols, footprints, and parameter data in accordance with internal workflows.

Manage layout tasks independently from concept through fabrication data release to support schedule and technical requirements.

Lead advanced layout efforts using High-Density Interconnect, microvias, via-in-pad, back drilling, and specialized substrate materials.

Required Qualifications

Education:

A Bachelor of Science, Master of Science, or PhD in a relevant engineering discipline is required.

Experience:

Candidates must possess a minimum of 8 to 12 years of experience performing engineering and layout of printed circuit boards, with extensive utilization of Xpedition software.

Technical

Skills:

Experience with the layout of multi-layer, high-density printed circuit boards and circuit card assemblies, including high-speed digital, RF, and mixed-signal circuits. Demonstrated knowledge of fabrication and assembly processes, industry standard criteria, and the generation of technical documentation packages is required.

Preferred Qualifications Prior experience with programs that demand stringent reliability, documentation, and traceability requirements.

Demonstrated expertise in advanced, high-density, multi-layer printed circuit boards combining RF, high-speed digital, and high-power circuit sections.

Knowledge of process workflows and library management, including creation and governance of symbols, footprints, and reusable elements.

Ability to translate complex mechanical boundaries and electrical constraints into optimized physical layouts across multiple boards or modules.

Deep domain knowledge of high-reliability aerospace hardware criteria or comparable industry standards demonstrating equivalent rigor.

Everforth Apex is a world-class IT services company that serves thousands of clients across the globe. When you join Everforth Apex, you become part of a team that values innovation,…