Senior Wafer & Packaged Die Test Engineer
Listed on 2026-10-07
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Engineering
Test Engineer
Astek Corporation is seeking a Test Engineer to develop test programs for high-speed electronic components at wafer and packaged-die levels. You will understand high-speed circuitry and create robust test programs for ICs.
Ideal candidates hold a BSEE/BSCE with 5+ years in IC test engineering, strong programming and debugging skills, and experience with Verigy/Advantest 93K platforms, labs, and high-speed PLL/Serdes techniques.
We are currently recruiting a Senior Wafer & Packaged Die Test Engineer for our team in Colorado Springs, CO, United States.
If your experience matches this role, we encourage you to apply.
All applications are reviewed carefully by our team.
The position is based in Colorado Springs, CO, United States.
This opportunity is part of our work in Engineering.
The advertised compensation is 90..
We aim to respond to suitable candidates as soon as possible.
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