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Integrated Circuit Backend​/Physical Design Engineer

Job in Columbus, Franklin County, Ohio, 43224, USA
Listing for: Battelle
Full Time position
Listed on 2026-10-15
Job specializations:
  • Engineering
    Electronics Engineer, Systems Engineer, Hardware Engineer, Electrical Engineering
Salary/Wage Range or Industry Benchmark: 86000 - 123000 USD Yearly USD 86000.00 123000.00 YEAR
Job Description & How to Apply Below

Battelle delivers when others can’t. We conduct research and development, manage national laboratories, design and manufacture products and deliver critical services for our clients—whether they are a multi-national corporation, a small start-up or a government agency.

We recognize and appreciate the value and contributions of individuals from a wide range of backgrounds and experiences and welcome all qualified individuals to apply.

Job Summary

Battelle's Advanced Microsystem Solutions Business Line develops advanced integrated circuit technologies and hardware assurance solutions for government and commercial customers. We are seeking a Backend/Physical Design Engineer to support implementation and signoff of advanced digital integrated circuits and systems-on-chip (SoCs) in our Columbus, Ohio location.

The successful candidate will be responsible for physical design implementation, timing closure, power optimization, physical verification, and tape-out activities across advanced semiconductor technologies. The ideal candidate will have experience with industry-standard backend design tools, static timing analysis, signal integrity analysis, and physical design methodologies.

This role offers the opportunity to contribute to cutting-edge microelectronics programs focused on secure and high-performance computing technologies while collaborating closely with RTL design, verification, foundry, and technology teams.

Responsibilities
  • Execute physical design implementation from netlist to GDSII
  • Perform floor planning, power planning, and pin placement
  • Conduct placement optimization and clock tree synthesis (CTS)
  • Perform detailed routing and optimization for timing, power, and area
  • Achieve timing closure across corners and modes
  • Conduct power analysis and implement power reduction techniques
  • Perform signal integrity analysis and resolve SI/IR drop violations
  • Execute physical verification checks (DRC, LVS, antenna, ERC)
  • Generate timing constraints and perform static timing analysis
  • Collaborate with front-end design and verification teams
  • Work with foundry and technology teams on design rule compliance
  • Create and maintain physical design documentation and reports
  • Develop and improve physical design methodologies and flows
  • Support signoff activities and tape-out preparations
  • Debug and resolve design issues found during physical verification
Key Qualifications
  • Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or related field
  • 3+ years of physical design experience
  • Strong experience in physical design flow (floor planning, placement, clock tree synthesis, routing, optimization)
  • Expertise in static timing analysis (STA) and timing closure techniques
  • Knowledge of power analysis and power optimization methodologies
  • Experience with signal integrity, IR drop analysis, and EM/electromigration analysis
  • Proficiency with physical verification (DRC, LVS, antenna, ERC)
  • Hands-on experience with industry-standard backend EDA tools (Cadence Innovus)
  • Scripting skills (TCL, Python) for automation and flow development
  • Understanding of process technology nodes and design rules
  • Knowledge of clock domain crossing (CDC) and timing constraints
  • Familiarity with standard cell libraries and design kits
  • Knowledge of Version Control (Git)
  • Must be a US citizen and able to obtain and maintain US Government security clearance
Preferred Qualifications
  • Experience with advanced technology nodes
  • Experience with ASIC subsystem integration, top-level assembly, IO ring development, manual layout, and coordination of physical implementation activities through signoff and tapeout.
  • Low power design techniques (power gating, multi-voltage, retention)
  • FinFET or Gate-All-Around (GAA) technology experience
  • High-speed design and advanced…
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