Senior Lead Engineer, Manufacturing Process

Req
Region:
Americas
Country: USA
State/Province:
New Hampshire
City:
Remote Employee US

Functional Area: Engineering Career Stream: Process Engineering Manufacturing SAP Short Name: SLE-ENG-PRM Job Level: Level 09 IC/MGR: Individual Contributor Direct/Indirect Indicator: Indirect

Why Celestica?

Celestica is changing the future! We are imagining, developing and delivering a better future with our customers.

At Celestica, we foster a motivated, high-integrity work environment based on a strong set of corporate Values. These Values empower our employees to provide you with superior service.

Relentless Curiosity

We are obsessed with uncovering the information and insights that allow us to anticipate and overcome the challenges of the future.

Bold Conviction

We dare to envision new solutions, new technologies, new ways of working and invest to make it a reality.

Unwavering Dedication

We exemplify teamwork and commitment in every decision and every action to be the best partners to our customers and our colleagues.

The Senior Lead Engineer - Manufacturing Process is responsible for designing, developing, deploying and optimizing processes for manufacturing to achieve quality cost and delivery goals for Celestica and its customers products.

• Responsible for understanding and implementing the customer’s technical roadmap and related process development projects.
• Lead and implement the development and release of the full manufacturing process for new customer products.
• Understand and provide feedback on customer’s technical requirements to team members and management.
• Responsible for developing and implementing costed and optimized feedback using Design for manufacturability (DFX) tools and processes, with the goal of reducing manufacturing cost and improving quality and reliability of product.
• Develop, plan and lead the assessment of the capability of process applications using Design of Experiments.
• Devise process controls and data collection strategies and evaluate complex data to assist with reporting yield, reliability and diagnoses to root causes failures impacting product quality.
• Ensure accurate and timely communication to management on critical technical and business issues.

• NPI-PCBA: ESD, Component Prep, Laser marking, Solder Paste Deposition (screening / jetting) / Stencil Design, SMT component placement, Reflow, Tooling design, PTH soldering, PTH manual assembly, Press Fit assembly, Depanelization, Board level mechanical assembly, wire harness assembly, wire prep, SMT data analytics, SMT / PTH manual / automated rework, cleaning processes, coating / potting underfill / ruggedization processes, pack & ship, optical component assembly, fiber / tray handling processes, fiber splicing, IPC-610, quality data (KPI), Engineering Control & System Tools (ODC/SCE), Manufacturing Operational management, DFM - Mfg, DFA, DFR, Customer specific processes, structural test and inspection processes, machining, welding, CNC programming, secondary processes, sheet metal, DFAA.
• DFX: ESD Controls, Component Prep, Component Module Programming, Laser Marking, Screening, Stencil Design, Solder Paste Dispense / Jetting, SMT Programming, SMT Placement, SMT Reflow, Sweat Soldering, Flex Board Assembly / Handling, Pallet Design, PTH Soldering, Robot Soldering, PTH manual Assembly, PTH Auto Assembly, Pressfit, Depanelization, Mechanical Assemb;y (TIMs, Heatsinks, PCBA, Hotbar, Ultrasonic Welding), Wire Harness Assembly, Wire Prep, System Assembly, SMT and PTH Rework, Cleaning Processes, Conformal Coating, Underfills / Edge bonding / Potting, Pack and Ship, Chassis Assembly (fluidics, electrical enclosure, cable routing), Sheet Metal , Machining, Welding, Structural Test (API, AOI, AXI, ICT, Flying Probe)
• FA LAB: ESD Controls, Solder Metallurgy, Strain Gauge Analysis, SIR Testing, Solder Joint Reliability Modeling, Sample Prep (Grind and Polish), Dye & Pry, CMM/VMM, Lab X-Ray, Pull/Bend Testing, Vibration Testing, Drop Testing, TDR, XRF, SEM, FTIR, IC, Solderability Testing, Thermal Analysis, HALT/HASS, TH&B, Thermal Shock, ATC
• OPTICAL & XRAY INSPECTION: ESD…