Dielectric and Polymer Materials Engineer
Job in
Covington, Newton County, Georgia, 30015, USA
Listed on 2026-10-29
Listing for:
Absolics
Full Time
position Listed on 2026-10-29
Job specializations:
-
Engineering
Materials Engineering, Process Engineer, Quality Engineering, Manufacturing Engineer
Job Description & How to Apply Below
Title:
R&D Engineer - Dielectric and Polymer Materials Expert for Advanced Packaging applications
Location:
Covington, GAJob Type: Full-Time
About Us:
Absolics is a leading provider of advanced packaging technologies and services, offering scalable solutions for businesses of high-performance computing. We offer smart, innovative services to dozens of clients globally. By dedicating our efforts to establishing large glass substrates with built-in active and passive elements, our goal is to provide significant improvement in signaling characteristics and power consumption compared to existing solutions.
Job Description:
You will lead efforts to evaluate, down select and integrate the various Advanced Packaging Organic and Polymeric materials critical to advanced packaging process flows, with responsibility spanning material selection, film deposition or lamination, patterning, and cure characterization. In addition, you will oversee evaluation of material performance with respect to reliability testing and collaborate with downstream assembly teams to understand incoming assembly.
Requirements. This role requires both materials science depth and process integration awareness. You will evaluate both emerging and established dielectric systems and drive their optimization across electrical, mechanical, and reliability dimensions.
Key Responsibilities:
Characterize dielectric film properties (electrical, thermal, mechanical) and correlate to process and reliability outcomes
Select, qualify, and support process window definition of advanced packaging dielectrics (example ABF, PBO, PSPI, polyimide, inorganic films) for RDL build-up Support determination of optimal processing conditions for these materials across the various process teams critical to the overall fabrication process flow Evaluate emerging dielectric materials and technologies (e.g., low-Dk/Df, glass core compatible systems) for roadmap fit Develop and optimize cure, lamination, or photopatterning sequences for novel dielectric layers being tested
Investigate and resolve adhesion, delamination, cracking, or CTE-mismatch failures through materials and process analysis
Run reliability qualification testing (HAST, TCT) and interpret dielectric-driven failure mechanisms
Required Skills:
Hands-on experience evaluating, processing and/or successful qualification of two or more advanced packaging dielectrics, example ABF, PBO, PSPI, PID, Solder resist or BCBDeep knowledge of dielectric patterning approaches: photoexposure, develop, and cure sequences for photosensitive materials; or lamination and laser drill for non-photosensitive films
Extensive experience with film characterization: ellipsometry, FTIR, TGA/DSC, profilometry, nanoindentation
Understanding of dielectric-to-metal adhesion, CTE mismatch, and stress management in multilayer stacks
Experience with electrical characterization of dielectric films (Dk, Df, leakage, breakdown voltage)
Ability to execute reliability testing per JEDEC standards (HAST, uHAST, TCT) and interpret failure mechanisms
Fluent in English; proficiency in Korean is a plus.
Preferred Skills Direct experience with glass core or glass interposer dielectric process integration
Deep Familiarity with low-Dk/low-Df materials targeting high-frequency and AI/HPC applications
Knowledge of plasma-enhanced CVD or PVD inorganic dielectrics for thin-film packaging
Experience with CMP of dielectric films in damascene or hybrid bonding contexts
Background in failure analysis of dielectric delamination, cracking, or via integrity (FIB-SEM, TEM, laminography)
Familiarity with JEDEC and IPC qualification standards for substrate dielectrics
Track record of material supplier engagement and collaborative efforts for material testing and qualification
Publication record or patent activity in dielectric materials for packaging is a plus
Education
Ph.D. in Materials Science, Polymer Science, Chemical Engineering, Electrical Engineering, or related field preferredM.S. with 3+ years of relevant industry or research experience considered
Benefits:401K 6% matching (NO vesting period)
Healthcare 100% support (Health, Dental, Vision)
Life, STD, LTD 100 % support
Cell phone allowancePTO and self-development SALARY:$90,000 – $150,000
To View & Apply for jobs on this site that accept applications from your location or country, tap the button below to make a Search.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).
Search for further Jobs Here:
×