Process Integration Engineer

Requisition

Title:

R&D Engineer - Process Integration

Location:

Covington, GAJob Type: Full-Time

About Us:

Absolics is a leading provider of advanced packaging technologies and services, offering scalable solutions for businesses of high-performance computing. We offer smart, innovative services to dozens of clients globally. By dedicating our efforts to establishing large glass substrates with built-in active and passive elements, our goal is to provide significant improvement in signaling characteristics and power consumption compared to existing solutions.

Job Description:

We are seeking a highly skilled and experienced Process Integration Engineer to join our team. The successful candidate will be responsible for orchestrating and integrating critical process steps, such as:dielectric materials selection and applicationlithographywet + dry clean/etch/develop processesPVD and electroplatinginto a coherent, manufacturable process flow for fine-pitch, next-generation packaging architectures. You will support finalizing various Process Integration Plans, defining design rules, managing process window tradeoffs across module boundaries, and be the primary technical decision-maker to help navigate constraints in the full process flow.

You will work daily with the lithography, wet/dry process, dielectric, and plating engineers, translating their individual process capabilities into a working end-to-end flow, while also engaging with device/package design teams on architectures feasibility. In an early-stage environment, this role carries enormous influence on the finalized architecture and build-up decisions.

Key Responsibilities:

Oversee process integration, manage scheduling, and provide comprehensive progress reports to upper management.

Develop and implement process integration strategies to optimize production yield and efficiency.

Coordinate with cross-functional teams to ensure seamless integration of processes.

Monitor and analyze process performance, identifying areas for improvement.

Ensure compliance with industry standards and safety regulations.

Troubleshoot and resolve process-related issues in a timely manner.

Maintain detailed documentation of processes and procedures.

Generate innovative ideas for patent filings.

Required Skills:

Demonstrated experience integrating multi-step package build up process flows (SAP and/or damascene), from lithography through metallization and dielectric build-up Strong working knowledge across the full unit-process stack: photolithography, wet/dry etch, PVD seed deposition, dielectric film processing, and electroplating, sufficient to identify cross-process interactions and failure handoffs

Experience authoring or owning Process Integration Plans, design rules (line/space, via CD, registration/overlay budgets, taper angle specs), and process flow documentation

Track record of root-causing yield or reliability excursions that span multiple process modules (e.g., seed undercut driving downstream plating defects, via CD variation driving lithography-etch mismatch)
Statistical process control and DOE methodology for multi-variable, multi-step process optimization

Strong cross-functional collaboration skills; ability to translate unit-process engineer findings into integration-level decisions and vice versa

Familiarity with metrology and failure analysis techniques across the flow (SEM, FIB cross-section, CD-SEM, overlay metrology, electrical test)
Understanding of registration, overlay, and CD budget allocation across sequential build-up layers

Fluent in English; proficiency in Korean is a plus.

Preferred Skills

Experience with glass core substrates

Direct experience scaling fine line/space RDL, including via CD control and multi-layer registration challenges

Experience…