PCB Rework Technician

• We are seeking a highly skilled PCB Rework Technician specializing in fine-pitch micro-soldering to join our hardware engineering team.
• In this role, you will be responsible for precise assembly, modification, replacement, and repair of complex Surface Mount Technology (SMT) and Through-Hole (TH) printed circuit board assemblies.
• You will work extensively under high-magnification microscopes to execute delicate micro-soldering procedures on high-density assemblies.

• Micro-Soldering & Rework:
  Perform precision hand soldering, desoldering, component replacement, and rework on fine-pitch components (including 0201/01005 passives, QFNs, BGAs, WLCSPs, and ultra-fine pitch ICs).
• BGA Rework & Inspection:
  Operate BGA rework stations for component removal, reballing, site preparation, and alignment. Utilize X-ray inspection equipment to verify solder joint integrity, voiding, and alignment.
• PCB Repair:
  Execute advanced trace repair, pad restoration, wire jumper installation, and ground plane repair using micro-drilling and conductive adhesives/epoxies where necessary.
• Inspection & Quality Assurance:
  Inspect PCBA work using high-magnification stereo microscopes and optical inspection tools in strict accordance with IPC-A-610 and IPC-7711/7721 standards.
• Prototyping & Modifications:
  Support engineering teams by performing manual ECO (Engineering Change Order) modifications, jumper wire additions, and component swaps on prototype boards.
• Equipment Maintenance:
  Maintain and calibrate precision soldering irons, hot‑air rework stations, preheaters, micro‑tweezers, and ESD‑safe workstation gear.
• Documentation:
  Track rework history, defect logs, and yield metrics in the ERP/MES system.
• Qualifications & Requirements
• Experience:
  
  Minimum 3–5+ years of hands‑on experience in precision PCB rework and micro‑soldering within an electronics manufacturing, hardware R&D, or repair environment.
• Certifications:
  
  Current or past IPC‑A‑610 and/or IPC‑7711/7721 certifications strongly preferred (J‑STD‑001 is a plus).

• Proficiency in working under continuous stereo microscope magnification.
• Expert‑level micro‑soldering skill using hot air tools, micro‑tweezers, thermal strippers, and specialized solder tips.
• Demonstrated capability to rework 0201/01005 components, BGA/QFN packages, and 0.4mm pitch ICs.
• Experience reading and interpreting engineering schematics, assembly drawings, bill of materials (BOM), and ECO documentation.
• Physical & Aptitude Requirements:
  Excellent manual dexterity, steady hands, strong spatial reasoning, and visual acuity for fine detail. Good communication skills and the ability to work in a fast‑paced engineering environment.
• ESD Knowledge:
  Deep understanding of Electrostatic Discharge (ESD) prevention protocols and safe handling of sensitive semiconductor components.

• Familiarity with basic hardware troubleshooting.
• Ability to use CAD/board viewing software (e.g., Allegro, Altium, or similar).
• Experience with automated optical inspection (AOI) or X‑ray inspection systems.
• Background in high‑reliability industries such as aerospace, medical device, defense, or automotive electronics.
• Familiarity with conformal coating removal and re‑application techniques.

“Mindlance is an Equal Opportunity Employer and does not discriminate in employment on the basis of – Minority/Gender/Disability/Religion/LGBTQI/Age/Veterans.”