Sr. Hardware Engineer - Interconnects, Annapurna Labs

Sr. Hardware Engineer - Interconnects, Annapurna Labs (AWS)

Amazon Web Services (AWS) invites experienced hardware engineers to join the Annapurna Labs organization, an AWS UC subgroup that designs silicon and software to accelerate innovative cloud solutions.

As a senior member of the Hardware Design team, you will define, design, and validate AWS’ next‑generation machine‑learning chips, cards, and server integration. Your work will cover PCIe and Ser Des topics, creating customized high‑performance platforms for AWS datacenters.

• Lead design, evaluation, and release of server backplane and cable interconnect solutions for high‑performance compute systems.
• Own end‑to‑end development of high‑speed connectors, including definition, selection, 3D modeling, simulation review, and mechanical integration.
• Collaborate with electrical, mechanical, and system architects to ensure interconnect designs meet signal integrity (SI), power integrity (PI), and thermal requirements.
• Manage relationships with connector and cable vendors, including spec alignment, technical reviews, and performance validation.
• Apply fundamental signal integrity principles to optimize high‑speed links and reduce EMI/EMC challenges.
• Drive connector and cable manufacturing processes, including DFM, tooling, assembly techniques, and quality control.
• Support failure analysis, root cause investigations, and field issue resolutions related to interconnect systems.
• High‑speed PCB design experience is a plus.

• Experience in developing functional specifications, design verification plans, and functional test procedures.
• Bachelor’s degree in Electrical or Mechanical Engineering or related field.
• 6+ years of experience in connector or cable assembly design for high‑speed applications.
• Deep understanding of server backplane cable technologies including twinax, DAC, fiber, and hybrid solutions.
• Hands‑on experience with high‑speed connector technologies (e.g., SFP/QSFP, MCIO, EDSFF, OCP standards).
• Strong fundamentals in signal integrity, including channel loss, crosstalk, impedance, and return loss.
• Proficiency in mechanical and electrical CAD tools (e.g., Creo, Solid Works, Allegro).
• Excellent written and verbal communication skills.

• Master’s degree in electrical engineering, computer engineering, or equivalent.
• Experience working with interdisciplinary teams to execute product design from concept to production.
• Experience with the project management of technical projects.
• Experience working with hyperscale compute, data center, or storage hardware.
• Knowledge of SI simulation tools (e.g., Ansys HFSS, Keysight ADS) is a plus.
• Familiarity with industry standards such as PCIe, SAS, SATA, IEEE, or OCP.
• Demonstrated success in vendor management and supplier development programs.
• Ability to work in a fast‑paced, ambiguous, and collaborative environment.

Base pay ranges from $128,600 per year in the lowest geographic market up to $213,600 per year in the highest geographic market. Total compensation may include equity, sign‑on payments, and other benefits. For more information, visit the Amazon benefits page.

Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.

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