IC Layout Engineer 5D/3D-IC Specialist
Listed on 2026-10-06
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Engineering
Packaging Engineer
Annapurna Labs (U.S.) Inc. in Cupertino, CA is seeking a Package Layout Design Engineer to drive advanced IC package layouts from floor planning through tape-out. You will partner with ASIC teams, SI/PI, and manufacturing to meet density, performance and reliability targets.
The role requires hands-on experience with packaging tools, 2.5D/3D-IC packaging, RDL/substrate routing, and rigorous DFM/verification to ensure production-ready designs for next‑gen ML and data center ASICs.
This posting is for the IC Package Layout Engineer — 2.5D/3D-IC Specialist role at Amazon Web Services (AWS), based in Cupertino, CA, United States.
The IC Package Layout Engineer — 2.5D/3D-IC Specialist role at Amazon Web Services (AWS) is now open for applications in Cupertino, CA, United States.
Join us at Amazon Web Services (AWS) as our next IC Package Layout Engineer — 2.5D/3D-IC Specialist in Cupertino, CA, United States.
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