Senior SI/PI Engineer D-IC 5D Packaging
Listed on 2026-10-07
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Engineering
Packaging Engineer
Annapurna Labs (U.S.) Inc. in Cupertino is seeking a Sr. Signal & Power Integrity Engineer to own the package-level SI/PI strategy for next‑gen machine learning and data center ASICs. You will drive 2.5D/3D-IC packaging decisions spanning die-to-die interfaces and board connections.
You will perform high‑speed simulations, PDN impedance analyses, IR drop studies, and EMIR validation using HFSS, Sigrity, and Cadence tools, translating results into robust design guidelines and flows.
As a Senior SI/PI Engineer for 3D-IC & 2.5D Packaging, you will play an important part at Amazon Web Services (AWS) in Cupertino, CA, United States.
We are seeking a motivated Senior SI/PI Engineer for 3D-IC & 2.5D Packaging to join Amazon Web Services (AWS) in Cupertino, CA, United States.
Consider building your career as a Senior SI/PI Engineer for 3D-IC & 2.5D Packaging at Amazon Web Services (AWS).
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