Cloud Hardware Development, Packaging, Network Product Development - Optics

Do you like to apply deep hardware engineering expertise to deliver simple, sustainable, and scalable solutions for large networks? Would you like to play a key role in driving the stability and efficiency of next-generation network infrastructure, starting from the silicon up?

AWS Infrastructure Services owns the design, planning, delivery, and operation of all AWS global infrastructure. In other words, we're the people who keep the cloud running. We support all AWS data centers and all of the servers, storage, networking, power, and cooling equipment that ensure our customers have continual access to the innovation they rely on. We work on the most challenging problems, with thousands of variables impacting the supply chain — and we're looking for talented people who want to help.

You'll join a diverse team of software, hardware, and network engineers, supply chain specialists, security experts, operations managers, and other vital roles. You'll collaborate with people across AWS to help us deliver the highest standards for safety and security while providing seemingly infinite capacity at the lowest possible cost for our customers. And you'll experience an inclusive culture that welcomes bold ideas and empowers you to own them to completion.

We are looking for a Sr. Cloud Hardware Development Engineer (CHDE) with packaging expertise to join our Network Product Development (NPD) team. In this role, you will enable the components that form the backbone of AWS network interconnect. You will perform high-quality design, development, validation, and sustaining engineering of IC and SOC packages for high-speed applications, working closely with design teams, manufacturing partners, and cross-functional stakeholders to deliver robust solutions  job responsibilities

Key job responsibilities

Packaging hardware development engineer (CHDE) perform high quality design, development, validation, deployment, and sustaining engineering of integrated circuit (IC) and system on chiop (SOC) packages for high-speed applications for AWS network. They work closely with design teams, manufacturing partners, and cross-functional stakeholders to deliver robust packaging and integated solutions.
• Collaborate with vendors/manufacturers to evaluate new packaging technologies (IC and SOC), materials, and assembly processes. Create implementation plans for incorporating them into product roadmaps.
• Develop and automate test plans for package characterization including signal integrity, power integrity, thermal performance, and mechanical reliability.
• Collaborate with vendors/manufacturers in defining and developing test plans for IC/SOC packages, substrates, and interconnect technologies.
• Work with operations teams in identifying quality issues, improving manufacturing yields, and optimizing RMA processes for packaged components.

A day in the life

On an everyday basis as part of our team, you have the unique opportunity to understand the growing AWS network and our internal customers’ requirement on interconnect solutions and their components. You'll work backwards to devise hardware solutions by influencing the broad industry and/or to develop software tools with sister teams to maintain a highly available network that delights AWS customers.

You design and implement processes and mechanisms that both help the team to deliver business impact to the organization in a systemic way, while also helping to raise the bar on our operational excellence. Operating at the scale we do, there is no blueprint for how to do what we do, which encourages our engineers to identify and develop simple solutions to complex problems.

We encourage durable solutions that look around corners while taking into consideration our…