Career Accelerator Program - Packaging Engineer - MS​/PhD

Career Accelerator Program – Packaging Engineer – MS/PhD at Texas Instruments (Dallas, TX)

• Partner with the businesses to design and develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness.
• Participate in cross‑functional teams, supporting product qualification and production, helping to meet reliability and yield requirements, design testability, and test coverage.
• Direct design‑of‑experiments and work with material suppliers to down select innovative packaging materials to enhance the reliability and performance of advanced packages.
• Conduct electrical, mechanical, thermal models to comprehend silicon‑to‑package interaction, establish design rules, and predict and prevent the use of high‑risk designs.

• Master’s degree in Mechanical Engineering, Physics, or related field.
• Cumulative 3.0/4.0 GPA or higher.

• Cumulative 3.5/4.0 GPA or higher.
• Demonstrated expertise in mechanical stress analysis and management.
• Hands‑on experience in mechanical stress modeling using industry software such as ANSYS.
• Hands‑on experience or working knowledge of mechanical characterization of materials (metals/alloys, polymers, ceramics, etc.).
• Semiconductor back‑end‑of‑line processing knowledge is preferred (fab manufacturing processes for Al and Cu based back‑end‑of‑line).
• Semiconductor packaging knowledge is preferred (manufacturing processes, assembly, reliability, materials, characterization, FA).
• Demonstrated analytical and problem‑solving skills.
• Strong written and verbal communication skills.
• Ability to work in teams and collaborate effectively with people in different functions.
• Strong time‑management skills that enable on‑time project delivery.
• Ability to build strong, influential relationships.
• Ability to work effectively in a fast‑paced and rapidly changing environment.
• Ability to take the initiative and drive for results.

Texas Instruments is an equal‑opportunity employer and supports a diverse, inclusive work environment. All qualified applicants will receive consideration for employment without regard to race, color, religion, creed, disability, genetic information, national origin, gender, gender identity and expression, age, sexual orientation, marital status, veteran status, or any other characteristic protected by federal, state, or local laws.

Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere.

Learn more at