Packaging Engineering Intern - Shape -Gen Semiconductors
Listed on 2026-10-13
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Engineering
Packaging Engineer, Electrical Engineering
Texas Instruments in Dallas is seeking a Packaging Engineering Intern to engage in design, development, and analysis of semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs, and more. You will work across cross-functional teams to advance packaging innovations in material, mechanical, thermal, and electrical characterization.
The internship offers exposure to TI's analog and embedded processing products, opportunities to contribute to differentiating packages, and
We are currently recruiting a Packaging Engineering Intern - Shape Next-Gen Semiconductors for our team in Dallas, TX, United States.
If your experience matches this role, we encourage you to apply.
All applications are reviewed carefully by our team.
The position is based in Dallas, TX, United States.
This opportunity is part of our work in Engineering.
The advertised compensation is 28.000 - 41.000.
We aim to respond to suitable candidates as soon as possible.
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