Global Head of Quantum Device Fabrication & Packaging
Listed on 2026-11-06
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Engineering
Packaging Engineer, Manufacturing Engineer, Operations Management, Product Engineer
Universal Quantum seeks a Head of Device Fabrication, Advanced Packaging and Assembly to lead the development, industrialisation and delivery of foundry processes, advanced packaging and assembly for quantum processors. Based in Singapore, this role oversees a global team across Singapore and Japan, partnering with foundries, OSATs and materials suppliers.
You will own the R&D roadmap from concept to qualified manufacturing, driving cross-functional execution with Systems Engineering, Device
We are currently recruiting a Global Head of Quantum Device Fabrication & Packaging for our team in United States.
All applications are reviewed carefully by our team.
This is a Full Time role.
The position is based in United States.
This opportunity is part of our work in Engineering.
The advertised compensation is 250..
We aim to respond to suitable candidates as soon as possible.
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