Mechatronic Design and Release Engineer – In-Vehicle Infotainment

In this position...The Mechatronic Design and Release Engineer is responsible for the development and integration of critical infotainment and connectivity systems, including the IVI ECU (with displays and touchscreens), gateway modules, and the telematics modem (cellular 4G/5G, GNSS/GPS, Wi‑Fi, and Bluetooth), as well as antennas, eSIM, and V2X. This role focuses on the electronics, power and thermal performance, packaging, and vehicle integration of these systems, ensuring seamless interface with the vehicle's electrical network and high-speed data networks.

In this position...The Mechatronic Design and Release Engineer is responsible for the development and integration of critical infotainment and connectivity systems, including the IVI ECU (with displays and touchscreens), gateway modules, and the telematics modem (cellular 4G/5G, GNSS/GPS, Wi‑Fi, and Bluetooth), as well as antennas, eSIM, and V2X. This role focuses on the electronics, power and thermal performance, packaging, and vehicle integration of these systems, ensuring seamless interface with the vehicle's electrical network and high-speed data networks.

The engineer is accountable for all product deliverables from initial design through production launch, including the design and execution of comprehensive mechatronic test setups and detailed test cases to validate system performance, power and thermal behavior, connectivity, and reliability. This includes both bench‑level and vehicle‑level validation, often requiring custom tools and methodologies to ensure system robustness, signal integrity, and physical integration into the vehicle.

• Support all vehicle prototype builds, product launch, and service issues related to IVI, gateway, and connectivity electronic hardware and mechatronic integration.
• Develop and execute comprehensive test plans, including the creation of original test cases and custom testing tools for both bench and vehicle-level validation.
• Perform circuit simulations, power and thermal studies, and hardware-level analysis using tools such as LTSpice and MATLAB to ensure robust electronic design, including thermal management of high‑performance SoCs and power stages.
• Lead the power performance, thermal management, and physical packaging of IVI modules, including PCB layout density, enclosure design, EMI shielding, heat dissipation strategy, and power budget/quiescent draw management.
• Lead the integration of these systems into the vehicle, including module mounting, harness routing, thermal interfaces to vehicle structure, and antenna placement and routing for optimal cellular, GNSS, Wi‑Fi, and V2X signal performance.
• Support the electromechanical integration of displays and touchscreens, including mounting, optical bonding, haptic feedback hardware, and thermal behavior of large‑format displays.
• Lead the troubleshooting and problem‑resolution process using vehicle network tools (Vector CANalyzer/CANoe) and high-speed network analysis tools. Collect and analyze data, review system schematics, and evaluate vehicle EDS as required.
• Collaborate closely with Component, Architecture, Systems Engineering teams to ensure hardware/software compatibility and alignment with vehicle electrical and connectivity requirements.
• Support the development of robust foundation documents, including DFMEA, Design Specifications, D/PVPR, and Worst‑Case Circuit Analysis (WCCA).
• Lead technical design reviews for module hardware requirements, thermal/power interfaces, and mechanical/packaging interfaces.
• Manage Tier 1 supplier engineering activities on a case‑by‑case basis to ensure component delivery meets Ford’s rigorous quality and timing standards.
• Lead cross‑functional teams to drive timely resolution of…