Assistant​/Associate Professor Advanced Packaging and Heterogeneous Integration

Assistant/Associate Professor Advanced Packaging and Heterogeneous Integration

Are you a leading researcher in advanced packaging and heterogeneous integration, ready to shape the future of semiconductor systems and build a world‑class research program at TU Delft?

The Section of Electronic Components, Technology and Materials (ECTM) at Delft University of Technology invites applications for an Associate Professor position in Advanced Packaging and Heterogeneous Integration.

This strategic position is created to further strengthen TU Delft’s internationally leading activities in advanced semiconductor packaging, system integration, and reliability, building on the distinguished legacy of Prof. Guoqi Zhang. You will play a key role in shaping next‑generation system integration technologies that underpin future AI, high‑performance computing, photonics, automotive, and sustainable electronic systems.

We are seeking a candidate who can develop and lead a world‑class research program, bridging fundamental science, engineering, and industrial application.

• Develop an internationally visible and externally funded research program in advanced packaging and heterogeneous integration
• Provide scientific leadership and contribute to the strategic direction of the ECTM section
• Acquire substantial competitive funding (e.g., NWO, Horizon Europe, Chips JU, industry partnerships)
• Build and expand collaborations with leading semiconductor companies and research institutes (e.g., ASML, IMEC, European ecosystem)
• Contribute to education in microelectronics, including teaching and supervision of MSc and PhD students
• Strengthen TU Delft’s position in Europe’s semiconductor and advanced packaging ecosystem

• Advanced electronic packaging and system integration
• Chiplet architectures and interconnect technologies
• 3D integration and hybrid bonding
• Wafer‑level and panel‑level packaging
• Photonic‑electronic co‑integration
• Thermal management and thermo‑mechanical reliability
• Multi‑physics modeling and digital twins for electronics
• Power electronics and wide‑bandgap packaging
• RF/mmWave and high‑frequency packaging technologies

• PhD in Electrical Engineering, Materials Science, Mechanical Engineering, Applied Physics, or a related field
• Strong international research track record, demonstrated through high‑impact publications and/or patents
• Recognized expertise in advanced packaging and/or heterogeneous integration
• Proven ability to acquire competitive research funding
• Experience supervising PhD students and postdoctoral researchers
• Demonstrated ability to collaborate with industry

• Experience in emerging domains such as chiplet‑based systems, AI hardware integration, co‑packaged optics, or reliability‑aware design
• Strong track record in industry collaboration or technology transfer
• Vision for developing future directions in semiconductor system integration

The position is offered as an Academic Career Track position (0.8 – 1.0 FTE) with progression toward a permanent Associate Professor within a maximum of eight years.

Salary scales: 11–12 (€4 728 – €7 297 per month) for temporary appointments, 13–14 (€6 512 – €8 673 per month) for permanent appointments. Additional benefits include health‑insurance discounts, a monthly work‑costs contribution, and the possibility of flexible work schedules or partial remote work.

University Teaching Qualification (UTQ) must be obtained within three years if less than five years of teaching experience. Dutch language training is available for non‑Dutch speakers.

Benefits are in accordance with the Collective Labour Agreement for Dutch Universities.