Assistant​/Associate Professor Advanced Packaging and Heterogeneous Integration

Are you a leading researcher in advanced packaging and heterogeneous integration, ready to shape the future of semiconductor systems and build a world-class research program at TU Delft?

The Section of Electronic Components, Technology and Materials (ECTM) at Delft University of Technology invites applications for an Associate Professor position in Advanced Packaging and Heterogeneous Integration.

This strategic position is created to further strengthen TU Delft’s internationally leading activities in advanced semiconductor packaging, system integration, and reliability, building on the distinguished legacy of Prof. Guoqi Zhang. You will play a key role in shaping next-generation system integration technologies that underpin future AI, high-performance computing, photonics, automotive, and sustainable electronic systems.

We are seeking a candidate who can develop and lead a world-class research program, bridging fundamental science, engineering, and industrial application.

You are expected to:

Develop an internationally visible and externally funded research program in advanced packaging and heterogeneous integration

Provide scientific leadership and contribute to the strategic direction of the ECTM section

Acquire substantial competitive funding (e.g., NWO, Horizon Europe, Chips JU, industry partnerships)

Build and expand collaborations with leading semiconductor companies and research institutes (e.g., ASML, IMEC, European ecosystem)

Contribute to education in microelectronics, including teaching and supervision of MSc and PhD students

Strengthen TU Delft’s position in Europe’s semiconductor and advanced packaging ecosystem

We are particularly interested in candidates with expertise in one or more of the following areas:

Advanced electronic packaging and system integration

Chiplet architectures and interconnect technologies

3D integration and hybrid bonding

Wafer-level and panel-level packaging

Photonic-electronic co-integration

Thermal management and thermo-mechanical reliability

Multi-physics modeling and digital twins for electronics

Power electronics and wide-bandgap packaging

RF/mmWave and high-frequency packaging technologies

Job requirements
Essential qualifications

PhD in Electrical Engineering, Materials Science, Mechanical Engineering, Applied Physics, or a related field

Strong international research track record, demonstrated through high-impact publications and/or patents

Recognized expertise in advanced packaging and/or heterogeneous integration

Proven ability to acquire competitive research funding

Experience supervising PhD students and postdoctoral researchers

Demonstrated ability to collaborate with industry

Preferred qualifications

Experience in emerging domains such as chiplet-based systems, AI hardware integration, co-packaged optics, or reliability-aware design

Strong track record in industry collaboration or technology transfer

Vision for developing future directions in semiconductor system integration

TU Delft (Delft University of Technology)
Working at TU Delft means contributing to solutions that really make a difference.

At TU Delft, our people make the difference. With their knowledge and curiosity, our staff provide high-quality education and conduct pioneering research that extends beyond the campus. You will have the opportunity to take the initiative, work with others, and grow as a professional while joining an international community of professionals and students.

Faculty of Electrical Engineering, Mathematics and Computer Science
The Faculty of Electrical Engineering, Mathematics and Computer Science (EEMCS) brings together three scientific disciplines. Combined, they reinforce each other and are the driving force behind the technology we all use in our daily lives. The faculty develops future chips and sensors, contributes to sustainable and future-proof electricity systems, and advances software technologies including AI.

We educate innovative engineers and offer substantial room for ground-breaking research, supported by excellent labs and facilities in a strong international environment.

Conditions of employment
This position is offered as an Academic Career Track position (0.8–1.0 FTE).

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