RF Packaging Engineer

RF Packaging Engineer

100% Remote

One team. Global challenges. Infinite opportunities. Our client is on a mission to deliver connections with the capacity to change the world. For more than 35 years, our client has helped shape how consumers, businesses, governments and militaries around the globe communicate. They’re looking for people who think big, act fearlessly, and create an inclusive environment that drives positive impact to join our team.

The Packaging Engineer position will entail all aspects of packaging development from planning, designing, developing advanced/novel packaging, and managing packaging efforts for RF communication products. The products range from IC’s, System In Packages, sub-assemblies, and modules. The packaging development process includes package definition, stack-up, substrate layout, bond diagram, drawings, modeling and simulation, technical risk/cost assessment, materials and process characterization, compilation of formal documentation, interfacing with sub-contractors and internal assembly and reliability resources, and final release of product.

Rate: $100 - $120 / hr. w2

• Working closely with project development teams and product groups (RFIC, MMIC, Module) to develop the next generation/advanced/novel packaging solution for RF communication products
• Define packages and materials that meet product requirements for reliability, performance, manufacturability, and cost.
• Ensure all packaging deliverables are met for New Product and New Technology Introductions
• Develop and manage packaging documentation including SOWs, package drawings, and process flows
• Design and layout of semiconductor packages including QFN, SiP, WL-CSP, RDL, Flip Chip, FO-WLP and Interposers
• Ensure early success in package development with modeling and simulation for thermal, mechanical, and electrical
• Technically oversee vendors in the manufacture of said packages in conjunction with manufacturing engineers
• Utilize your assembly knowledge of die attach, Wirebond, bumping, overmolding to advise product groups on options available to solve problems
• Identify suitable IC, sub-assembly, and module package options and perform feasibility studies for new products
• Interact with product groups for package/cost optimization along with mechanical engineering
• Specify and conduct reliability testing by vendors to insure the reliability of the packaged product
• Coordinate package related activities across multiple organizations including Marketing, Design, Applications, Test, Assembly Engineering, Quality, and Manufacturing (internal and external factories)
• Address and solve materials and processing issues that may occur during the development process
• Manage the package process using industry standard project management tools.
• Develop and maintain the packaging and technology roadmap through proposal support and long term technology programs

• 10+ years in semiconductor packaging including experience in package assembly process, package engineering, quality & reliability and the intersection/relationship of packaging to test.
• Deep understanding of micro-electronic package structure, mechanical, electrical and thermal performance.
• Strong understanding of heat transfer and its relation to material properties.
• Packaging knowledge in RFIC, millimeter ware, System In Package, sub-assembly, and/or modules.
• Experience in semiconductor package design with demonstrated experience in one or more of the following: QFN, SiP, BGA, WL-CSP, Flip Chip and Bumping or FO-WLP.
• Strong understanding of Die Prep, Assembly (die attach, Wirebond, flip chip, etc) and Surface Mount Technology (SMT) process-equipment is desired.
• Have a high tolerance for ambiguity and solid communication skills.
• Strong understanding of interconnect reliability daisy chain testing, CPI and BLR.
• Understands the metallization schemes for laminates, interposers and SMT.
• Knowledge of statistical methods and Design of Experiments.
• Must be able to work autonomously and help determine methods and procedures.
• Customer service oriented.
• Ability to work with design teams to translate IC/system requirements input packaging…