SiC Packaging Applications Engineer AI/HPC Data Centers
Listed on 2026-10-07
-
Engineering
Packaging Engineer
Wolfspeed is seeking an Applications Engineer for Advanced Packaging in Durham, NC. The role focuses on supporting customers integrating SiC substrates into 2.5D/3D packaging for HPC and AI data centers.
You will bridge materials knowledge with customer designs, guide use-case selection, and contribute to reference demos with thermal performance benchmarking. Responsibilities include remote/on-site support, co-design with foundries and OSATs, and presenting technical material at industry events.
We are looking to fill the SiC Packaging Applications Engineer for AI/HPC Data Centers position at Wolfspeed in Durham, NC, United States.
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
Learn more about the SiC Packaging Applications Engineer for AI/HPC Data Centers role in the description above.
We appreciate your interest in this position.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).