Senior Thermal and Mechanical Engineer

Overview

Job Title:

Thermal and Mechanical Sr. Engineer

About the role:

We are seeking a Thermal and Mechanical sr. Eng. for a client, initially be on a 6 month contract!
Responsibilities    Support the design  of accelerator cards and platforms, ensuring mechanical fit and thermal performance from concept to production hand-off — whether the cooling solution is developed  in-house  or  outsourced  to specialised cooling-solution suppliers.
Test and validate the cooling solution  end-to-end, including thermal simulation, simulation-to-test correlation, lab execution, and characterisation reporting suitable for senior management, suppliers, and customers.

Required Qualifications   Master’s degree in Mechanical Engineering, Thermal Engineering, or related field.
5–10 years of experience in mechanical and thermal design for electronics products at board and system level, including high-power-density and HPC-class platforms.
Extensive experience with CFD and FEM analysis of cooling solutions in electronics products.
Proven experience with AI accelerators, HPC-class cooling architectures: high-TDP chip cooling (200 W+), forced-air server integration, heat pipe and vapor chamber design.
Proficiency in 2D/3D CAD (e.g., NX, Solid Works, Catia, Creo, Solid Edge) and thermal simulation tools (e.g., FloEFD, ANSYS, COMSOL), including system-level airflow and rack-level thermal modelling.
Hands-on experience operating a thermal lab: thermal/climatic chambers, multi-channel data acquisition systems, sensor calibration, and instrumentation troubleshooting.
Strong communication and interpersonal skills — able to deliver concise, structured status updates and present clear technical conclusions to senior stakeholders and external partners.
Working knowledge of Python (or equivalent scripting language) for data acquisition, post-processing, and test automation.
Fluent in English, both spoken and written.
Preferred Skills   

Experience with AI/ML accelerator hardware, PCIe/M.2 form factors, or high-density edge compute platforms.
Familiarity with production quality processes (8D, FMEA, PPAP) and electromechanical co-design with PCB layout engineers.
Familiarity with measurement automation frameworks (LabVIEW, Python with PyVISA / PyDAQmx, or equivalent) and version-controlled lab data pipelines.

#J-18808-Ljbffr