System Solution Engineer - Optical Interconnect ICs Datacom; d​/m​/f

Position: System Solution Engineer - Optical Interconnect ICs for Datacom (d/m/f)
The LSPLight Sensors & Power Solutions division supplies sensors that bridge the gap between the world we live in and the digital world of machines. By converting physical signals - heartbeats, sounds, light waves - into data, we enable robots, cars and other devices to interact with people and improve our world. What drives CSA is a relentless desire to contribute to technology and have a meaningful impact on the world.

This business thrives on solving complex problems and partnering with global leaders at the forefront of technological advancement. Our goal: to push the boundaries of sensor technology and empower innovators to make the world smarter, healthier and happier.

Join us in Premstätten, Regensburg, Pavia or Eindhoven and help define the future of optical connectivity for AI and data centers:

Translate customer architectures and application requirements into differentiated Integrated Circuit (IC) product concepts and roadmaps

Act as the technical voice of the customer across Product Management, R&D and Marketing

Engage directly with hyperscalers, networking companies, optical module suppliers and ecosystem partners

Drive the CMOS system architecture definition in the context of optics, photonics, mixed-signal ICs and packaging

Analyze market trends, competing technologies and emerging optical interconnect architectures

Identify CMOS IC technology gaps and recommend strategic investments for future product differentiation

Support technical design‑ins, customer evaluations and design‑win activities worldwide

Develop application notes, white papers, technical presentations and customer enablement materials

Represent ams OSRAM at customer workshops, technical conferences and industry events

Master's degree or PhD in Electrical Engineering, Microelectronics, Photonics or Physics

Proven experience with mixed‑signal CMOS, photodiodes, analog front‑ends, drivers, TIAs or Ser Des

Extensive industry experience in datacom, networking or optical interconnects

Solid understanding of datacenter (optical) links, transceivers and architectures

Strong system‑level thinking across optics, electronics, packaging and integration

Experience working directly with customers on complex technical challenges

Ability to translate market needs into differentiated semiconductor solutions

Excellent English communication skills;
German is a plus

For Austria:
We offer competitive salaries and additional benefits based on your performance, experience and qualification.

The employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group H (https://(Use the "Apply for this Job" box below).). We offer a higher compensation depending on your expertise and skills.

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