Photonics Advanced Packaging Engineer

What you will do
As a Photonics advanced packaging engineer , you will contribute to developing photonic solutions for a wide range of different research projects including Laser, Hybrid integration, LiDAR, Co-Packaged Optics, Datacom, and Biosensors. This starts with identifying and enabling photonic packaging paths for integrated photonics in collaboration with internal and external partners. With these packaging paths, you manage efficient operation of the packaging processes and develop next-generation photonics packaging technologies.

Role

Lead the development of laser integration and packaging solutions for integrated photonics, with a strong focus on III-V to Silicon (Silicon Nitride) packaging strategies.

Own and manage established packaging workflows in close collaboration with internal teams and external partners

Build new packaging paths for operational excellence and new demands.

Establish and improve design-for-packaging (DfP) guidelines covering optical, electrical, and thermal aspects.

Develop next-generation packaging and integration technologies for emerging applications.

Define and evaluate packaging architecture options, including trade-offs in performance, cost, and manufacturability.

Take the ownership of planning, scheduling, and execution of packaging campaigns as well as performance and yield analysis.

Demonstration and validation of packaged chips in a lab environment.

Share insights and experiences with the team and contribute to the development and maturity of packaging.

Prepare technical notes and documentation for internal and external customers. Optionally, file patents or publish your work.

What we do for you
We offer a challenging environment at the forefront of technology, in an international network of renowned industrial customers. This is your opportunity to bring new technologies to the market that will have an impact on tomorrow’s society.

100% employer-paid pension plan

flexible working hours

wide range of training possibilities

support in the relocation process

By joining the R&D team in Eindhoven, you will be part of a team of disruptive innovators and thinkers. Together, with our researchers and engineers, you will work on a variety of topics, including healthcare, agrifood, mobility and communications. We invite you to be part of our ambitious team where your ideas will have an impact on our society and our future lives.

Who you are

MSc with 4+ years of experience or Ph.D. in EE, physics, photonics, ME or equivalent with a few years of experience.

Hands-on experience with semiconductor laser packaging, including fiber coupling, butt coupling, and laser assembly techniques, is essential.

Good understanding of laser-related packaging processes is a must-have.

Solid understanding of electrical packaging and opto-electronic integration is highly desirable.

Good understanding of concepts in on- chip laser coupling is a strong plus

Industry field experience in photonics packaging is a strong plus. (strong academic experience will also be considered.

Experience with packaging design and mechanical CAD tools (e.g., Solid Works 3D) is a strong advantage.

Expertise of high-speed interconnects is a strong plus.

Experience with the design, simulation, and characterization of photonic integrated circuits (PICs) and opto-electronic components- including lasers, photodetectors, modulators, and spot-size converters, is an advantage. Familiarity with photonic simulation tools such as FDTD is a plus.

Proven project management skills are a plus

Self-driven and entrepreneurial attitude - you derive energy from taking ownership and can effectively deal with ambiguity. Able to think ahead and make plans in an organized manner.

Good written and verbal communication skills in English.

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