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R&D Scientist Micro-Optical Assembly and Packaging

Job in 5600, Eindhoven, North Brabant, Netherlands
Listing for: TNO
Full Time position
Listed on 2026-10-12
Job specializations:
  • Engineering
    Research Scientist, Electronics Engineer
  • Research/Development
    Research Scientist, Electronics Engineer
Salary/Wage Range or Industry Benchmark: 70000 - 95000 EUR Yearly EUR 70000.00 95000.00 YEAR
Job Description & How to Apply Below
About this position

TNO is the Netherlands Organisation for Applied Scientific Research. As an independent research institute, TNO connects science and industry to accelerate innovation and translate knowledge into practical, scalable solutions. By combining deep technical expertise with a focus on application, TNO supports companies and government bodies in addressing complex technological and societal challenges.

What will be your role?

TNO plays a leading role in the field of integrated photonics through two pioneering initiatives: the Photonic Integration Technology Center (PITC) and the Chip Integration Technology Center (CITC). Both centres were established by TNO together with industrial and technology partners. PITC focuses on the development of integrated photonic chips for applications in sectors such as mobility, healthcare, and communications. This enables innovations in areas such as traffic safety, health monitoring, and secure, energy-efficient data transmission.

CITC focuses on advanced semiconductor integration and chip packaging technologies, enabling compact and versatile photonic systems. Together, PITC and CITC provide a unique environment where photonic design, chip integration, and advanced packaging technologies come together. This environment facilitates groundbreaking research and development aimed at translating photonic innovations into scalable industrial solutions. To strengthen our activities in the field of photonic integration and packaging technologies, we are looking for a Scientist Micro-Optical Assembly & Packaging.

In this role, you will contribute to the development of advanced solutions for optical assembly and packaging of integrated photonic systems. Your work focuses on realizing reliable optical and electrical interfaces and scalable packaging technologies that enable the integration of photonic chips into practical systems and industrial applications. You work at the interface of integrated photonics, optical design, materials science, and advanced chip packaging technologies.

You collaborate closely with multidisciplinary teams within PITC and CITC, including experts in photonic design, semiconductor processing, materials engineering, and system integration. In an advanced R&D environment, you contribute to the development of micro-optical assembly processes, optical interconnects, and packaging solutions that enable high-performance and reliable photonic devices.

Key responsibilities
  • Defining and executing research activities regarding packaging technologies to improve the performance and manufacturing scalability of optical and electrical interconnects;
  • Designing and developing optical interconnects and coupling solutions for integrated photonic systems, aiming to improve optical coupling efficiency and interface performance between photonic chips and external optical systems;
  • Translating research results and experimental findings into reliable and scalable photonic packaging solutions in collaboration with industrial partners and international stakeholders;
  • Documenting and communicating technical results through technical reports, scientific publications, and project presentations;
  • Collaborating with multidisciplinary teams in the areas of photonics design, device manufacturing, materials science, and system integration.
What we expect from you

You are a hands-on scientist with a strong analytical mindset and a keen interest in integrated photonics and advanced chip packaging technologies.

Your qualifications
  • A Master's degree or PhD in Optical Engineering, Applied Physics, Materials Science, or a related scientific discipline;
  • Several years of experience in integrated photonics or micro-optical assembly;
  • Affinity with experimental work in the lab;
  • Experience with advanced packaging technologies, such as flip-chip assembly or wafer-level packaging is a big plus;
  • Experience with optical modelling tools such as Zemax, Lumerical, or similar simulation environments;
  • Practical experience with optical testing, measurement, or metrology equipment;
  • Ability to collaborate effectively within multidisciplinary research teams;
  • Strong communication skills in English, both written and verbal.
What you'll get in return

Challenging and varied work with a real impact.

And plenty of opportunities as, at TNO, you are in charge of shaping your career.

We offer a gross monthly salary (based on your knowledge and experience), 8% holiday pay, a 13th month bonus of 8.33% and a flex budget (5.58% + € 180). In…

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