Programme Director

A fast-growing deep-tech scale-up building a new AI compute platform from the ground up. Its proprietary processor architecture brings together custom silicon, stacked memory, advanced packaging, boards, firmware, system software and complete data centre systems. This is a rare chance to lead delivery of next-generation AI hardware while the organisation, and the way it works, is still being shaped.
This is not a PMO or reporting role. You'll be a hands-on semiconductor program leader who takes ownership of the integrated delivery of an AI compute platform, from product definition and architecture through tape-out, bring-up, package and system integration, software enablement, qualification and launch readiness.
What you'll own   One integrated program baseline: scope, schedule, cost, resources, risks, decisions and external dependencies
The silicon and tape-out critical path: RTL and verification readiness, design freeze, timing and power closure, sign-off evidence, mask release and foundry commitments
System-in-Package (SiP) and advanced packaging delivery, integrated with silicon, boards, firmware and software
Coordination of external partners, including physical design, foundry, memory, OSAT, packaging, test and IP vendors, holding owners to account at every interface
Evidence-based readiness reviews with clear exit criteria, not status reporting
Early identification of critical dependencies and recovery planning when things move off baseline
Clear trade-offs and decisions for executive review, covering roadmap, investment, capacity and risk
Building lean, practical Program Delivery ways of working as the business scales, and coaching program managers
What you'll bring   Personal ownership of at least one successful silicon tape-out, ideally through bring-up, qualification and productisation
Hands-on experience of SiP / advanced packaging programs
A background in complex ASIC, AI accelerator, HPC, data centre or similar deep-tech hardware programs
Strong understanding of semiconductor dependencies: architecture, RTL, verification, physical design, IP, PDKs, foundry, packaging and test
Experience managing external engineering, manufacturing and supply-chain partners
Strong program controls: integrated planning, dependency and risk management, change control and gate reviews
The confidence to influence without hierarchy and challenge plans constructively
Comfort with ambiguity, limited process and fast-changing priorities in a scale-up
A technical or engineering degree, or equivalent depth from industry experience
Working pattern and benefits   Full-time and on-site in the Netherlands. Relocation to the Netherlands is required.
30 days' holiday plus Dutch holiday allowance
An attractive employee share option scheme (ESOP)
Immediate or near-term start preferred