PhD position in multi-material additive manufacturing advanced chip cooling

We offer a fully funded 4-year PhD position within the University of Twente on the development of ultra-efficient cooling technologies for advanced semiconductor packaging. The project, Ultra Cool, combines materials science, additive manufacturing, thermal engineering, and semiconductor integration to enable direct bonding between silicon and high-conductivity metals such as copper.

The rapid growth of AI and high-performance computing is driving heat fluxes in advanced chip packages beyond 1,000 W/cm², making thermal management one of the key bottlenecks for future electronics. This PhD project aims to address this challenge through the design of novel interlayer alloys, development of multi-material Laser Powder Bed Fusion (LPBF) processes, and integration of cooling functionality directly into package-level demonstrators.

The research will focus on the thermodynamic design of interlayer alloy feed stocks, powder production and characterization, multi-material LPBF process optimization, and the investigation of interfacial physics governing residual stress, defect formation, and thermal transport across copper–silicon interfaces. You will work with characterization methods including SEM, EBSD, XRD, thermal conductivity analysis, and thermo-mechanical testing. The project also includes the fabrication and validation of package-level cooling demonstrators for direct and indirect chip cooling applications.

You will work in a highly interdisciplinary and international environment together with academic researchers and industrial partners active in semiconductor packaging, powder production, sensing technologies, and thermal management. The project offers excellent opportunities to contribute to high-impact scientific research while developing technologies with strong industrial relevance.

We are looking for a highly motivated, enthusiastic, and self-driven researcher who meets the following qualifications:

• A Master’s degree in Mechanical Engineering or Materials Science and Engineering or another relevant engineering/science discipline.
• Strong interest in additive manufacturing, materials development, thermal management, and semiconductor packaging.
• Experience with materials characterization techniques such as SEM, EBSD, XRD, thermal characterization methods, and mechanical testing is highly desirable.
• Familiarity with additive manufacturing processes, particularly Laser Powder Bed Fusion, is an advantage.
• Knowledge of metallurgy or computational materials engineering is beneficial.
• Ability to work independently and collaboratively within an interdisciplinary research environment.
• Strong analytical, experimental, and problem-solving skills.
• Motivation to contribute to both fundamental research and industrially relevant technology development.
• Excellent communication skills and proficiency in English, both spoken and written.

• A fully funded 4-year PhD position in an ambitious and internationally recognized research environment.
• Excellent working conditions, an exciting scientific environment, and a green and lively campus with lots of sports facilities and an international scientific community. The terms of employment are in accordance with the Dutch Collective Labour Agreement for Universities (CAO)
• Gross monthly salary of €3.059,- in the first year, which increases to €3.881,- in the fourth year
• Excellent benefits include a holiday allowance of 8% of the gross annual salary, a year-end bonus of 8.3%, and a solid pension scheme.
• You can make use of excellent facilities for professional and personal development and a training program in which you and your supervisor will make up a plan for additional suitable education and supervision.
• You will receive good…