New Grad Packaging Integration Engineer; .5D/3D
Listed on 2026-10-06
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Engineering
Packaging Engineer, Process Engineer, Manufacturing Engineer, Electronics Engineer
Global Foundries seeks a New College Graduate to join the Advanced Packaging and Silicon Photonics team as a Packaging Integration Engineer. You will collaborate with cross-functional teams to support the development and manufacturing of electro-optical transceivers using GF’s Photonix platform and advanced 2.5D/3D packaging technologies.
The role entails package integration, process development, reliability characterization, and data analysis, gaining hands-on experience in silicon photonics,
Are you ready to take on the New Grad Packaging Integration Engineer (2.5D/3D) role at Global Foundries inc.?
We have an opening for a New Grad Packaging Integration Engineer (2.5D/3D) in Essex, MD, United States within Engineering.
This role, New Grad Packaging Integration Engineer (2.5D/3D) at Global Foundries inc., could be your next move.
We would love to welcome a new New Grad Packaging Integration Engineer (2.5D/3D) to our group in Essex, MD, United States.
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