Lead Optical Packaging Engineer; SiPh & CPO
Listed on 2026-10-06
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Engineering
Packaging Engineer, Systems Engineer
Global Foundries inc. is seeking a Packaging Integration Engineer to lead optical packaging architectures for silicon photonics modules, including fiber attach and photonic die placement. You will drive 2.5D/3D/3.5D HI packaging, work with OSATs, and optimize reliability through multiphysics simulations.
The role requires a Master’s degree and 8+ years in semiconductor packaging with strong communications skills. Travel up to 25% to GF facilities or partners is expected.
We are currently recruiting a Lead Optical Packaging Engineer (SiPh & CPO) for our team in Essex, MD, United States.
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
Learn more about the Lead Optical Packaging Engineer (SiPh & CPO) role in the description above.
We appreciate your interest in this position.
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