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Sr. Technician - Failure Analysis

Job in Essex / Essex Junction, Chittenden County, Vermont, 05453, USA
Listing for: GlobalFoundries inc.
Full Time position
Listed on 2026-10-08
Job specializations:
  • Engineering
    Quality Engineering
Salary/Wage Range or Industry Benchmark: 48000 - 83000 USD Yearly USD 48000.00 83000.00 YEAR
Job Description & How to Apply Below
About Global Foundries:

Global Foundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, Global Foundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit  of Role:

Global Foundries' Fab 9 is seeking a Sr. Technician for Microelectronics Failure Analysis to join our advanced analytical laboratory in Essex Junction, VT. This hands‑on role supports high‑volume semiconductor manufacturing, yield learning, and root‑cause analysis through physical failure analysis techniques, including Secondary Ion Mass Spectrometry (SIM). This position is ideal for candidates with a strong technical foundation and interest in thin film analysis.

While prior thin film analysis experience is preferred, motivated candidates with related technical backgrounds will receive training and development to build expertise in advanced analytical methods. Technicians in this role will work closely with experienced engineers and senior lab staff to develop analytical skills and contribute to impactful investigations supporting Fab 9 operations. This role is fully on site at our Essex, VT facility.

This is a 12-hour day shift schedule (D1 shift) which is 7am - 7pm, working on a 2-2-3 cadence, with some built-in overtime within the shift schedule.

Key Responsibilities Prepare semiconductor samples for Transmission Electron Microscopy (TEM) using Focused Ion Beam (FIB) tools and other precision sample preparation techniques which may include wet/dry chemical etching

Execute sample preparation plans developed in collaboration with TEM engineers

Operate and maintain FIB equipment used for TEM lamella preparation and site-specific cross-sectioning

Ensure sample quality, dimensional accuracy, and proper documentation throughout the preparation process

Track and document work using lab information management systems (LIMS) and established reporting methods

Assist in the development and improvement of sample preparation methods, workflows, and best practices

Collaborate closely with engineers and lab staff to support yield, reliability, and technology investigations

Support preventive maintenance and basic troubleshooting activities on lab equipment

Maintain cleanroom and lab protocols while adhering to all safety requirements

Participate in training programs to develop advanced expertise in FIB-based sample preparation and failure analysis techniques

Contribute to a strong culture of safety, quality, teamwork, and continuous improvement

Other Responsibilities:

Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

Completes all management responsibilities and tasks

Required Qualifications

Education:

Associate's degree (2-year technical degree) in Engineering, Physics, Materials Science, Electronics, Semiconductor Manufacturing, Chemistry, Math, or a related technical discipline OR equivalent military technical training

Experience:

minimum 2-3 years' relevant technical lab, manufacturing, machining, microscopy, or semiconductor industry experience

Strong mechanical aptitude and attention to detail

Demonstrated problem-solving and organizational skills

Ability to learn and operate complex analytical equipment

Ability to follow detailed procedures and work with precision on delicate samples

Effective written and verbal communication skills

Fluency in English - both written and verbal

Experience supporting failure analysis, materials characterization, or process…
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