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Sr. Technician - Failure Analysis
Job in
Essex / Essex Junction, Chittenden County, Vermont, 05453, USA
Listed on 2026-10-08
Listing for:
GlobalFoundries inc.
Full Time
position Listed on 2026-10-08
Job specializations:
-
Engineering
Quality Engineering
Job Description & How to Apply Below
Global Foundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, Global Foundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit of Role:
Global Foundries' Fab 9 is seeking a Sr. Technician for Microelectronics Failure Analysis to join our advanced analytical laboratory in Essex Junction, VT. This hands‑on role supports high‑volume semiconductor manufacturing, yield learning, and root‑cause analysis through physical failure analysis techniques, including Secondary Ion Mass Spectrometry (SIM). This position is ideal for candidates with a strong technical foundation and interest in thin film analysis.
While prior thin film analysis experience is preferred, motivated candidates with related technical backgrounds will receive training and development to build expertise in advanced analytical methods. Technicians in this role will work closely with experienced engineers and senior lab staff to develop analytical skills and contribute to impactful investigations supporting Fab 9 operations. This role is fully on site at our Essex, VT facility.
This is a 12-hour day shift schedule (D1 shift) which is 7am - 7pm, working on a 2-2-3 cadence, with some built-in overtime within the shift schedule.
Key Responsibilities Prepare semiconductor samples for Transmission Electron Microscopy (TEM) using Focused Ion Beam (FIB) tools and other precision sample preparation techniques which may include wet/dry chemical etching
Execute sample preparation plans developed in collaboration with TEM engineers
Operate and maintain FIB equipment used for TEM lamella preparation and site-specific cross-sectioning
Ensure sample quality, dimensional accuracy, and proper documentation throughout the preparation process
Track and document work using lab information management systems (LIMS) and established reporting methods
Assist in the development and improvement of sample preparation methods, workflows, and best practices
Collaborate closely with engineers and lab staff to support yield, reliability, and technology investigations
Support preventive maintenance and basic troubleshooting activities on lab equipment
Maintain cleanroom and lab protocols while adhering to all safety requirements
Participate in training programs to develop advanced expertise in FIB-based sample preparation and failure analysis techniques
Contribute to a strong culture of safety, quality, teamwork, and continuous improvement
Other Responsibilities:
Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
Completes all management responsibilities and tasks
Required Qualifications
Education:
Associate's degree (2-year technical degree) in Engineering, Physics, Materials Science, Electronics, Semiconductor Manufacturing, Chemistry, Math, or a related technical discipline OR equivalent military technical training
Experience:
minimum 2-3 years' relevant technical lab, manufacturing, machining, microscopy, or semiconductor industry experience
Strong mechanical aptitude and attention to detail
Demonstrated problem-solving and organizational skills
Ability to learn and operate complex analytical equipment
Ability to follow detailed procedures and work with precision on delicate samples
Effective written and verbal communication skills
Fluency in English - both written and verbal
Experience supporting failure analysis, materials characterization, or process…
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