Quantum Topological Qubit Integration

Quantum Topological Qubit Integration
- Principal Engineer About Global Foundries Global Foundries  is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, Global Foundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets.

For more information, visit  Topological Qubit Integration (Principal Engineer) role is a key technical contributor within the Quantum Technology Solutions organization focused on enabling scalable topological quantum computing platforms. This position supports the integration of advanced materials, device architectures, and semiconductor process technologies required for topological qubits, bridging emerging device concepts with manufacturable semiconductor solutions. This role works closely with integration leadership and cross-functional teams to translate quantum device requirements into practical, scalable process integration schemes aligned with performance, yield, and reliability targets.

Summary of Role As a Principal Engineer, this role contributes to the development and execution of semiconductor integration strategies for topological qubit systems. The engineer will focus on integrating III V materials, superconducting films, and topological device structures with semiconductor processes, including BEOL interconnect and heterogeneous integration. The position emphasizes hands-on technical execution, data-driven problem solving, and cross-functional collaboration to enable robust and scalable quantum hardware platforms.

Essential Responsibilities Support integration of topological quantum devices, including III‑V heterostructures, superconducting materials, and hybrid material systems

Develop and execute process integration flows across device modules, BEOL interconnect, and heterogeneous integration schemes

Work with epitaxy and materials teams to ensure integration of III‑V layers, superconductors, and interfaces meets device performance requirements

Contribute to integration of device architectures supporting qubit operation as well as cryogenic read-out and control circuitry

Analyze device and process interactions, including defectivity, variability, contamination, and interface quality

Execute DOE (Design of Experiments) and analyze electrical and physical characterization data to guide process optimization

Support development of superconducting interconnect and low-loss BEOL wiring for operation at cryogenic temperatures

Collaborate with device engineering to ensure alignment between device physics requirements (e.g., coherence, noise, thermal performance) and integration

Participate in yield-learning activities, including root-cause analysis and corrective action implementation

Contribute to definition and tracking of technical milestones, including performance, variability, and reliability metrics

Work cross-functionally with process, materials, packaging, and design enablement teams to ensure successful end-to-end integration

Document integration flows, assumptions, and technical learnings to support scalable development and knowledge transfer

Other Responsibilities:

Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

Required Qualifications BS or MS in Electrical Engineering, Physics, Materials Science, or related field5+ years of experience in semiconductor process or integration engineering

Experience with semiconductor device physics and materials interactions

Familiarity with advanced materials systems…