Packaging Design Integration Engineer — New Grad
Listed on 2026-10-11
-
Engineering
Packaging Engineer, Systems Engineer, Electronics Engineer, Engineering Design & Technologists
Global Foundries is seeking a highly motivated New College Graduate to join the Advanced Packaging and Silicon Photonics team as a Packaging Design Integration Engineer. You will collaborate with experienced engineers and cross-functional teams to support chip package co-design activities for electro-optical transceivers using GF’s Photonix platform and advanced 2.5D/3D packaging technologies.
The role involves thermal, mechanical, electrical, and optical design integration, including design rule
The Packaging Design Integration Engineer — New Grad position in the IT & Technology, Engineering field is open for applications.
All applications are reviewed carefully by our team.
The position is based in Essex Junction, VT, United States.
This opportunity is part of our work in IT & Technology, Engineering.
The advertised compensation is 85..
We aim to respond to suitable candidates as soon as possible.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).