Lead Optical Packaging Engineer – SiPh & s
Listed on 2026-10-11
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Engineering
Packaging Engineer, Systems Engineer
Global Foundries is seeking a Photonic Packaging Engineer to lead development and sustainment of advanced optical packaging for SiPh and co-packaged optics. You will collaborate across photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low-loss packaging architectures meeting stringent reliability targets.
You will drive HI integration, support mass production readiness, and participate in cost-reduction initiatives while presenting roadmaps to internal and external
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This posting is for the Lead Optical Packaging Engineer – SiPh & HI Solutions role at Global Foundries, based in Essex Junction, VT, United States.
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