Cryogenic Quantum Bump Integration Engineer
Listed on 2026-10-11
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Engineering
Systems Engineer, Manufacturing Engineer, Mechanical Engineer, Process Engineer
Global Foundries U.S. Inc. in Essex Junction, VT is seeking a skilled R&D bump process engineer to join the Quantum Advanced Packaging team.
You will own development and integration of cryogenic, superconducting bumping processes enabling scalable quantum hardware packaging. The role involves leading cryogenic bump tech development, defining process flows, optimizing structures, and coordinating with device/qubit, cryogenic system teams, packaging & assembly teams, modeling and reliability teams,
Our organisation is growing, and we are hiring a Cryogenic Quantum Bump Integration Engineer in Essex Junction, VT, United States.
We have an opening for a Cryogenic Quantum Bump Integration Engineer in Essex Junction, VT, United States within Engineering.
This role, Cryogenic Quantum Bump Integration Engineer at GLOBALFOUNDRIES U.S. INC., could be your next opportunity.
Are you ready to take on the Cryogenic Quantum Bump Integration Engineer role at GLOBALFOUNDRIES U.S. INC.?
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