Photonics Packaging Integration Engineer; .5D/3D
Listed on 2026-10-11
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Engineering
Packaging Engineer
Global Foundries U.S. INC.
seeks a hands-on assembly integration professional to deliver electro-optical transceivers using GF’s Photonix platform and advanced packaging 2.5D/3D modalities. The role focuses on tool-process interactions for SiPh Flip Chip assembly, emphasizing product and module reliability, packaging design rules, materials selection, and reliability qualifications for chiplet/module packages.
The Photonics Packaging Integration Engineer (2.5D/3D) position in the Engineering field is open for applications.
Please review the full job details above before applying.
If your experience matches this role, we encourage you to apply.
All applications are reviewed carefully by our team.
The position is based in Essex Junction, VT, United States.
This opportunity is part of our work in Engineering.
The advertised compensation is 94..
We aim to respond to suitable candidates as soon as possible.
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