New Grad Packaging Integration Engineer – Silicon Photonics
Listed on 2026-10-11
-
Engineering
Packaging Engineer, Electronics Engineer
Global Foundries seeks a highly motivated New College Graduate to join the Advanced Packaging and Silicon Photonics team as a Packaging Integration Engineer. You will collaborate with cross-functional engineering teams to support development and manufacturing of electro-optical transceivers using GF’s Photonix platform and advanced packaging technologies.
You will contribute to package integration, process development, reliability characterization, and data analysis while gaining hands-on
Join us at Global Foundries as our next New Grad Packaging Integration Engineer – Silicon Photonics in Essex Junction, VT, United States.
Learn more about the New Grad Packaging Integration Engineer – Silicon Photonics role in the description above.
We appreciate your interest in this position.
Join Global Foundries and contribute to our ongoing work.
Take a moment to read everything above and see whether this role is right for you.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).