Senior Optical Packaging Engineer – SiPh & 3D
Listed on 2026-10-11
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Engineering
Packaging Engineer, Systems Engineer
Global Foundries is seeking a Packaging Engineer to lead optical packaging development for silicon photonics and co-packaged optics. You will coordinate across photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low-loss, cost-effective packaging designs.
Responsibilities include defining architectures, enabling high-density fiber-to-chip coupling, and driving 2.5D/3D packaging integration.
Are you ready to take on the Senior Optical Packaging Engineer – SiPh & 3D HI role at Global Foundries?
The position is based in Essex Junction, VT, United States.
This opportunity is part of our work in Engineering.
The advertised compensation is 148..
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
Learn more about the Senior Optical Packaging Engineer – SiPh & 3D HI role in the description above.
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